Abstarct: Abstract Ultra-precision machining, commonly known as Single Point Diamond Turning (SPDT), has become one of the most strategic technologies in developed countries for producing specific and brittle components. One of the main chanllenges of this technology is the high cost of cutting tools. This study analyzes and identifies the wear mechanisms of diamond tools in the ultra-precision machining process of silicon. The results of the conducted experiments highlight the importance of process optimization to reduce costs and increase production efficiency. In this research, experiments were designed to investigate the impact of machining parameters, including spindle speed(cutting speed), feed rate, and depth of cut, on tool wear and the surface quality of silicon components. Findings from X-Ray Diffraction (XRD) and Raman Spectroscopy indicate the amorphization of surface laxyers of the components after machining and a reduction in the intensity of crystalline peaks, correlating with cutting speed. Tool wear analysis using Scanning Electron Microscopy (SEM) reveals the type and magnitude of wear on the rake face and flank face. It shows that a significant increase in the thickness of the undeformed chip compared to the optimal state, despite low tool wear, does not produce a suitable surface finish. Finally, this study presents the optimal parameters that achieve the desired surface quality (surface roughness) with minimal tool wear in the machining process.